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GS74108ATP/J/X
SOJ, TSOP, FP-BGA Commercial Temp Industrial Temp Features
* Fast access time: 8, 10, 12 ns * CMOS low power operation: 120/95/85 mA at minimum cycle time * Single 3.3 V power supply * All inputs and outputs are TTL-compatible * Fully static operation * Industrial Temperature Option: -40 to 85C * Package line up J: 400 mil, 36-pin SOJ package GJ: RoHS-compliant 400 mil, 36-pin SOJ package TP: 400 mil, 44-pin TSOP-II package GP: RoHS-compliant 400 mil, 44-pin TSOP-II package X: 6 mm x 10 mm FPBGA package GX: RoHS-compliant 6 mm x 10 mm FPBGA package * RoHS-compliant packages available
A4 A3 A2 A1 A0 CE DQ1 DQ2 VDD VSS DQ3 DQ4 WE A17 A16 A15 A14 A13
512K x 8 4Mb Asynchronous SRAM
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
8, 10, 12 ns 3.3 V VDD Center VDD and VSS
SOJ 512K x 8-Pin Configuration
36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 NC A5 A6 A7 A8 OE DQ8 DQ7 VSS VDD DQ6 DQ5 A9 A10 A11 A12 A18 NC
36-pin 400 mil SOJ
Description
The GS74108A is a high speed CMOS Static RAM organized as 524,288 words by 8 bits. Static design eliminates the need for external clocks or timing strobes. The GS74108A operates on a single 3.3 V power supply and all inputs and outputs are TTL-compatible. The GS74108A is available in 400 mil SOJ, 400 mil TSOP-II, and 6 mm x 10 mm FPBGA packages.
FP-BGA 512K x 8 Bump Configuration (Package X)
1 2 3 4 5 6
Pin Descriptions Symbol
A0-A18 DQ1-DQ8 CE WE OE VDD VSS NC
Description
Address input Data input/output Chip enable input Write enable input Output enable input +3.3 V power supply Ground No connect
A B C D E F G H
NC DQ1 DQ2 VSS VDD DQ3 DQ4 NC
OE NC NC NC NC NC NC A16
A2 A1 A0 A18 A17 A13 A14 A15
A6 A5 A4 A3 A9 A10 A11 A12
A7 CE NC NC NC NC WE A8
NC DQ8 DQ7 VDD VSS DQ6 DQ5 NC
6 mm x 10 mm
*All GSI Technology packages are at least 5/6 RoHS compliant. Packages listed with the additional "G" designator are 6/6 RoHS compliant.
Rev: 1.07 1/2006
1/13
(c) 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS74108ATP/J/X
TSOP-II 512K x 8-Pin Configuration
NC NC A4 A3 A2 A1 A0 CE DQ1 DQ2 VDD VSS DQ3 DQ4 WE A17 A16 A15 A14 A13 NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 NC NC NC A5 A6 A7 A8 OE DQ8 DQ7 VSS VDD DQ6 DQ5 A9 A10 A11 A12 A18 NC NC NC
44-pin 400 mil TSOP II
Block Diagram
A0 Address Input Buffer
Row Decoder
Memory Array
A18 CE WE OE
Column Decoder
Control
I/O Buffer
DQ1
DQ8
Rev: 1.07 1/2006
2/13
(c) 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS74108ATP/J/X
Truth Table CE
H L L L Note: X: "H" or "L"
OE
X L X H
WE
X H L H
DQ1 to DQ8
Not Selected Read Write High Z
VDD Current
ISB1, ISB2
IDD
Absolute Maximum Ratings Parameter
Supply Voltage Input Voltage Output Voltage Allowable power dissipation Storage temperature
Symbol
VDD VIN VOUT PD TSTG
Rating
-0.5 to +4.6 -0.5 to VDD +0.5 ( 4.6 V max.) -0.5 to VDD +0.5 ( 4.6 V max.) 0.7 -55 to 150
Unit
V V V W
o
C
Note: Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation shall be restricted to Recommended Operating Conditions. Exposure to higher than recommended voltages for extended periods of time could affect device reliability.
Recommended Operating Conditions Parameter
Supply Voltage for -8/-10/-12 Input High Voltage Input Low Voltage Ambient Temperature, Commercial Range Ambient Temperature, Industrial Range
Symbol
VDD VIH VIL TAc TAI
Min
3.0 2.0 -0.3 0 -40
Typ
3.3 -- -- -- --
Max
3.6 VDD +0.3 0.8 70 85
Unit
V V V
o
C C
o
Notes: 1. Input overshoot voltage should be less than VDD +2 V and not exceed 20 ns. 2. Input undershoot voltage should be greater than -2 V and not exceed 20 ns. Rev: 1.07 1/2006 3/13 (c) 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS74108ATP/J/X
Capacitance Parameter
Input Capacitance Output Capacitance
Symbol
CIN COUT
Test Condition
VIN = 0 V VOUT = 0 V
Max
5 7
Unit
pF pF
Notes: 1. Tested at TA = 25C, f = 1 MHz 2. These parameters are sampled and are not 100% tested.
DC I/O Pin Characteristics Parameter
Input Leakage Current Output Leakage Current Output High Voltage Output Low Voltage
Symbol
IIL ILO VOH VOL
Test Conditions
VIN = 0 to VDD Output High Z VOUT = 0 to VDD IOH = -4 mA ILO = +4 mA
Min
- 1 uA -1 uA 2.4 --
Max
1 uA 1 uA -- 0.4 V
Power Supply Currents
Parameter Symbol Test Conditions CE VIL All other inputs VIH or VIL Min. cycle time IOUT = 0 mA CE VIH All other inputs VIH or VIL Min. cycle time CE VDD - 0.2V All other inputs VDD - 0.2V or 0.2V 0 to 70C 8 ns 10 ns 12 ns 8 ns -40 to 85C 10 ns 12 ns
Operating Supply Current
IDD
120 mA
95 mA
85 mA
130 mA
105 mA
95 mA
Standby Current
ISB1
30 mA
25 mA
22 mA
40 mA
35 mA
32 mA
Standby Current
ISB2
10 mA
20 mA
Rev: 1.07 1/2006
4/13
(c) 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS74108ATP/J/X
AC Test Conditions Parameter
Input high level Input low level Input rise time Input fall time Input reference level Output reference level Output load
Conditions
VIH = 2.4 V VIL = 0.4 V tr = 1 V/ns tf = 1 V/ns 1.4 V 1.4 V Fig. 1& 2
Output Load 1
DQ 50 VT = 1.4 V 30pF1
Output Load 2
3.3 V DQ 5pF1 589 434
Notes: 1. Include scope and jig capacitance. 2. Test conditions as specified with output loading as shown in Fig. 1 unless otherwise noted. 3. Output load 2 for tLZ, tHZ, tOLZ and tOHZ
AC Characteristics Read Cycle
Parameter Read cycle time Address access time Chip enable access time (CE) Output enable to output valid (OE) Output hold from address change Chip enable to output in low Z (CE) Output enable to output in low Z (OE) Chip disable to output in High Z (CE) Output disable to output in High Z (OE) * These parameters are sampled and are not 100% tested. Symbol tRC tAA tAC tOE tOH tLZ* tOLZ* tHZ* tOHZ* -8 Min 8 -- -- -- 3 3 0 -- -- Max -- 8 8 3.5 -- -- -- 4 3.5 Min 10 -- -- -- 3 3 0 -- -- -10 Max -- 10 10 4 -- -- -- 5 4 Min 12 -- -- -- 3 3 0 -- -- -12 Max -- 12 12 5 -- -- -- 6 5 Unit ns ns ns ns ns ns ns ns ns
Rev: 1.07 1/2006
5/13
(c) 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS74108ATP/J/X
Read Cycle 1: CE = OE = VIL, WE = VIH
tRC Address tAA tOH Data Out Previous Data Data valid
Read Cycle 2: WE = VIH
tRC Address tAA CE tAC tLZ OE tOE Data Out tOLZ High impedance
DATA VALID
tHZ
tOHZ
Rev: 1.07 1/2006
6/13
(c) 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS74108ATP/J/X
Write Cycle
Parameter Write cycle time Address valid to end of write Chip enable to end of write Data set up time Data hold time Write pulse width Address set up time Write recovery time (WE) Write recovery time (CE) Output Low Z from end of write Write to output in High Z * These parameters are sampled and are not 100% tested. Symbol tWC tAW tCW tDW tDH tWP tAS tWR tWR1 tWLZ* tWHZ* -8 Min 8 5.5 5.5 4 0 5.5 0 0 0 3 -- Max -- -- -- -- -- -- -- -- -- -- 3.5 Min 10 7 7 5 0 7 0 0 0 3 -- -10 Max -- -- -- -- -- -- -- -- -- -- 4 Min 12 8 8 6 0 8 0 0 0 3 -- -12 Max -- -- -- -- -- -- -- -- -- -- 5 Unit ns ns ns ns ns ns ns ns ns ns ns
Write Cycle 1: WE control
tWC Address tAW OE tCW CE tAS WE tDW Data In tWHZ Data Out
HIGH IMPEDANCE DATA VALID
tWR
tWP tDH
tWLZ
Rev: 1.07 1/2006
7/13
(c) 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS74108ATP/J/X
Write Cycle 2: CE control
tWC Address tAW OE tAS CE tWP WE tDW Data In Data Out
DATA VALID
tWR1
tCW
tDH
HIGH IMPEDANCE
36-Pin SOJ, 400 mil
Dimension in inch D L c E HE GE Symbol A A1 A2 B B1
A
Dimension in mm min -- 0.66 2.67 0.33 0.61 0.15 23.37 10.04 -- 10.93 9.00 2.08 -- 0o nom -- -- 2.80 0.43 0.71 0.20 23.47 10.16 1.27 11.05 9.30 -- -- -- max 3.70 -- 2.92 0.53 0.81 0.30 23.60 10.28 -- 11.17 9.60 -- 0.10 10o
min -- 0.026 0.105 0.013 0.024 0.006 0.920 0.395 -- 0.430 0.354 0.082 -- 0o
nom -- -- 0.110 0.017 0.028 0.008 0.924 0.400 0.05 0.435 0.366 -- -- --
max 0.146 -- 0.115 0.021 0.032 0.012 0.929 0.405 -- 0.440 0.378 -- 0.004 10o
1
e
c D E
A
A2
A1
y
B B1
e Detail A Q HE GE L y Q
Notes: 1. Dimension D& E do not include interlead flash. 2. Dimension B1 does not include dambar protrusion/intrusion.
Rev: 1.07 1/2006
8/13
(c) 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS74108ATP/J/X
44-Pin, 400 mil TSOP-II
44
D
23
c
Dimension in inch Dimension in mm Symbol min nom max min nom max
A -- 0.002 0.037 0.01 -- 0.721 0.396 -- 0.455 0.016 -- -- 0
o
-- -- 0.039 0.014 0.006 0.725 0.400 0.031 0.463 0.020 0.031 -- --
0.047 -- 0.041 0.018 -- 0.729 0.404 -- 0.471 0.024 -- 0.004 5
o
-- 0.05 0.95 0.25 -- 18.31 10.06 -- 11.56 0.40 -- -- 0
o
-- -- 1.00 0.35 0.15 18.41 10.16 0.80 11.76 0.50 0.80 -- --
1.20 -- 1.05 0.45 -- 18.51 10.26 -- 11.96 0.60 -- 0.10 5o
HE
A
E
A1 A2 B c D E e
1 A2
e
22 B
A
A1
y L1 L
HE L L1 Detail A Q y Q
Notes: 1. Dimension D& E do not include interlead flash. 2. Dimension B does not include dambar protrusion/intrusion. 3. Controlling dimension: mm
Rev: 1.07 1/2006
9/13
(c) 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS74108ATP/J/X
6 mm x 10 mm FPBGA
D
Symbol A A1
Unit: mm 1.100.10 0.20~0.30
fb
f0.30~0.40
0.36(TYP) 10.00.05 5.25 6.00.05 3.75 0.75(TYP) 0.10
E
Pin A1 Index
c D D1 E E1
Top View
e aaa
A
c
A1
Pin A1 Index
Side View
ABCDEFGH
aaa
fb Solder Ball
1 2 3 4 5 6
e
E1
e D1
Bottom View
Rev: 1.07 1/2006
10/13
(c) 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS74108ATP/J/X
Ordering Information Part Number1
GS74108ATP-8 GS74108ATP-10 GS74108ATP-12 GS74108ATP-8I GS74108ATP-10I GS74108ATP-12I GS74108AGP-8 GS74108AGP-10 GS74108AGP-12 GS74108AGP-8I GS74108AGP-10I GS74108AGP-12I GS74108AJ-8 GS74108AJ-10 GS74108AJ-12 GS74108AJ-8I GS74108AJ-10I GS74108AJ-12I GS74108AGJ-8 GS74108AGJ-10 GS74108AGJ-12 GS74108AGJ-8I GS74108AGJ-10I GS74108AGJ-12I GS74108AX-8 GS74108AX-10 GS74108AX-12 GS74108AX-8I GS74108AX-10I
Package2
400 mil TSOP-II 400 mil TSOP-II 400 mil TSOP-II 400 mil TSOP-II 400 mil TSOP-II 400 mil TSOP-II RoHS-compliant 400 mil TSOP-II RoHS-compliant 400 mil TSOP-II RoHS-compliant 400 mil TSOP-II RoHS-compliant 400 mil TSOP-II RoHS-compliant 400 mil TSOP-II RoHS-compliant 400 mil TSOP-II 400 mil SOJ 400 mil SOJ 400 mil SOJ 400 mil SOJ 400 mil SOJ 400 mil SOJ RoHS-compliant 400 mil SOJ RoHS-compliant 400 mil SOJ RoHS-compliant 400 mil SOJ RoHS-compliant 400 mil SOJ RoHS-compliant 400 mil SOJ RoHS-compliant 400 mil SOJ 6 mm x 10 mm FPBGA 6 mm x 10 mm FPBGA 6 mm x 10 mm FPBGA 6 mm x 10 mm FPBGA 6 mm x 10 mm FPBGA
Access Time
8 ns 10 ns 12 ns 8 ns 10 ns 12 ns 8 ns 10 ns 12 ns 8 ns 10 ns 12 ns 8 ns 10 ns 12 ns 8 ns 10 ns 12 ns 8 ns 10 ns 12 ns 8 ns 10 ns 12 ns 8 ns 10 ns 12 ns 8 ns 10 ns
Temp. Range
Commercial Commercial Commercial Industrial Industrial Industrial Commercial Commercial Commercial Industrial Industrial Industrial Commercial Commercial Commercial Industrial Industrial Industrial Commercial Commercial Commercial Industrial Industrial Industrial Commercial Commercial Commercial Industrial Industrial
Status3
MP MP MP MP MP MP PQ PQ PQ PQ PQ PQ MP MP MP MP MP MP PQ PQ PQ PQ PQ PQ MP MP MP MP MP
Rev: 1.07 1/2006
11/13
(c) 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS74108ATP/J/X
Ordering Information Part Number1
GS74108AX-12I GS74108AGX-8 GS74108AGX-10 GS74108AGX-12 GS74108AGX-8I GS74108AGX-10I GS74108AGX-12I
Package2
6 mm x 10 mm FPBGA RoHS-compliant 6 mm x 10 mm FPBGA RoHS-compliant 6 mm x 10 mm FPBGA RoHS-compliant 6 mm x 10 mm FPBGA RoHS-compliant 6 mm x 10 mm FPBGA RoHS-compliant 6 mm x 10 mm FPBGA RoHS-compliant 6 mm x 10 mm FPBGA
Access Time
12 ns 8 ns 10 ns 12 ns 8 ns 10 ns 12 ns
Temp. Range
Industrial Commercial Commercial Commercial Industrial Industrial Industrial
Status3
MP PQ PQ PQ PQ PQ PQ
Notes: 1. Customers requiring delivery in Tape and Reel should add the character "T" to the end of the part number. For example: GS74108ATP-8T. 2. All GSI Technology packages are at least 5/6 RoHS compliant. Packages listed with the additional "G" designator are 6/6 RoHS compliant. 3. MP = Mass Production. PQ = Pre-Qualification.
Rev: 1.07 1/2006
12/13
(c) 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS74108ATP/J/X
4M Asynchronous Datasheet Revision History Rev. Code: Old; New
74108A_r1 74108A_r1; 74108A_r1_01 74108A_r1_01; 74108A_r1_02 74108A_r1_02; 74108A_r1_03 74108A_r1_03; 74108A_r1_04 74108A_r1_04; 74108A_r1_05 74108A_r1_05; 74108A_r1_06 74108A_r1_06; 74108A_r1_07
Types of Changes Format or Content
Format/Content Content Content Content Content Content Content Content
Page #/Revisions/Reason
* Creation of new datasheet * Added 6 ns speed bin * Updated all power numbers * Updated Recommended Operating Conditions table on page 4 * Added 7 ns bin to entire document * Added X package * Removed 6 ns speed bin from entire document * Corrected "X" package pinout * Removed 7 ns speed bin from entire document * Updated format * Added Pb-free information for TSOP-II package * Added Pb-free information for FP-BGA package * Added RoHS-compliant information for SOJ * Changed Pb-free references to RoHS-compliant * Added status to ordering information table
Rev: 1.07 1/2006
13/13
(c) 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

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